摘要
研究了不同温度下甲基硅树脂基复合材料拉伸强度及介电性能变化,利用IR和TG分别对甲基硅树脂的耐热性和高温下的化学结构变化进行了分析,通过SEM、EDS对复合材料烧蚀前后表面化学成分和结构进行了表征。结果表明,在室温～1 200℃,复合材料的介电常数(ε)和损耗角正切值(tanδ)随着温度升高都增加;随着温度升高,硅树脂热分解的程度增加,化学结构发生了变化,复合材料拉伸强度下降;随温度升高,硅树脂产生了影响介电性能的游离碳,从而影响了电磁波在复合材料中的传输。
The tensile strength and dielectric property of methyl silicone resin composites under different temperatures were investigated. The heat resistance and chemical structure change of methyl silicone resin under high temperature were analyzed by means of IR and TG, and chemical composition and structure of the composite surface before and after ablation were characterized by means of SEM and EDS. The results show that the dielectric constant（~） and the tangent （tant3）of loss angle of the composites increase with temperature from room temperature to 1 200 ~C ; with increase of temperature, decomposition of methyl silicon resin speeds up, its chemical structure changes, and the tensile strength of the composites reduces; with increase of temperature, free carbon affecting dielectric property is generated in silicone resin, which influencs the transmission of electromagnetic wave in methyl silicone resin composites.
出处
《固体火箭技术》
EI
CAS
CSCD
北大核心
2007年第4期348-352,共5页
Journal of Solid Rocket Technology
基金
国家自然科学基金重点项目(No.50333030)
关键词
硅树脂基复合材料
介电性能
拉伸强度
silicone resin composites
dielectric performance
tensile strength
