摘要
结合实际工作中的经验和体会,探讨球栅阵列元器件焊点的气孔现象及其产生机理,重点讨论气孔与焊点可靠性的关系,认为非焊点与基板界面处(IMC)及焊点和BGA的Substrate结合处的气孔对焊点可靠性的影响不是很显著。最后,通过对人、机、料、法、环5个环节进行分析,找到避免产生气孔的一些途径。
Integrating with the experience of practical work, the void phenomenon of Ball Grid Array and the emergent mechanism of void were discussed in the paper, and the influence of void on solder joint reliability were discussed on emphasis. It was found that if the small void is not between the pad and the surface of PCB, it had no influence on solder joint reliability. In the end, the article analysed five ways to avoid void which is man, machine, material, method, environment.
出处
《焊接技术》
北大核心
2007年第4期66-69,共4页
Welding Technology
关键词
球栅阵列
气孔
机理
焊点可靠性
BGA, void, mechanism, solder joint reliability
