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聚碳酸酯及聚碳酸酯合金导热绝缘高分子材料的研究 被引量:15

Study on thermal conducting insulating polycarbonate and polycarbonate/ABS polymers
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摘要 分别以聚碳酸酯(PC)、聚碳酸酯和ABS合金(PC/ABS)为基体,以氧化铝(Al2O3)、碳化硅(SiC)、氧化铋(BiO)等作为导热填料,用挤出机造粒,注塑机成型样条。研究了填料种类、形状、填充量对复合材料的导热性能和力学性能的影响。结果表明,填充30wt%-50wt%氧化铝的PC导热系数从原来的0.2提高到0.528W/mK;30wt%SiC填充PC/ABS的导热系数为1.099 W/mK;30wt%BiO填充PC/ABS的导热系数达1.226W/mK。其中30wt%SiC填充PC/ABS的综合性能最好。填料有一定的长径比,对材料的力学性能和形成导热网链有利。 Polycarbonate(PC) and PC-ABS polymers with various inorganic fillers including alumina, silicon carbide (SIC) and bismuth oxide (BiO) with different shape were prepared by an extrusion process. Samples were shaped by injection molding to investigate the effective thermal conductivities and mechanical properties of the materials. The thermal conductivity of PC increases from the original of 0.2 to 0. 528 W/mK with filling of 30 % -50 % Al2O3 and that of PC- ABS filled with 30 % SiC and 30 % BiO increases to 1. 099 W/mK and 1.226 W/InK, respectively. The fillers with higher aspect ratio are benefit to the mechanical properties and the forming of connectivity.
出处 《材料热处理学报》 EI CAS CSCD 北大核心 2007年第4期51-54,共4页 Transactions of Materials and Heat Treatment
关键词 导热系数 聚碳酸酯(PC) 聚碳酸酯合金(PC/ABS) 填料 力学性能 thermal conductivity polycarbonate, polycarbonate alloy filler mechanical properties
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