摘要
小型化和多功能化是SAW器件发展的主要动力。文章回顾了SAW器件封装的发展历史,介绍了金属封装、塑料封装、SMD封装各自的特点,详述了芯片倒装技术及芯片尺寸SAW封装(Chip Sized SAW Package,CSSP)技术,将通用芯片倒装技术(Flip Chip Bonding,FCB)和SAW封装的特点结合,使封装尺寸减小到极限。然后对今后的复合封装进行了展望。
Increasing the levels of functional integration and permanent miniaturization are therefore the major driving forces in current SAW filter development. This article reviews the SAW filter development history, narrates the flip chip technology and the Chip Size SAW Package （CSSP） technology, and combines consequent package size reduction, filter application-specific technological performance made possible by the Flip Chip Bonding （FCB） technology. Views the next generation - complex package,
出处
《电子与封装》
2007年第7期1-4,9,共5页
Electronics & Packaging
