摘要
建立了粘接界面层多孔隙缺陷微观结构的界面数理模型,推导了横波(SH波)在“三明治”结构传播的频散方程,对最低模式的SH波在带有多孔隙缺陷界面的双层板粘接结构的传播特性进行数值计算分析。结果表明,粘接界面层的厚度及其孔隙缺陷尺寸对导波的频散曲线有明显的影响,这可为粘接界面无损检测提供了新的方法和思路。
A mathematic model of the micro-mechanism of porosity flaws in the adhesive layer had been built up. The characteristics of the lowest model SH waves propagating on the ＂sandwich＂ structure had been given by analyzing the dispersion equations of SH waves propagating on the structure. The results indicated that the thickness and efficiency modulus of the adhesive layer with porosity flaw could be expressed by the dispersion curves, a new nondestructive way to detecting the porosity flaw in the adhesive layer was presented.
出处
《无损检测》
北大核心
2007年第1期16-19,共4页
Nondestructive Testing
关键词
粘接界面
多孔隙缺陷
有效模量
SH波
Adhesive layer
Porosity flaws
Efficiency modulus
SH waves
