期刊文献+

添加微量稀土元素对Sn-Ag-Cu系无铅焊料性能的影响 被引量:13

Influence of Trace Rare Earth Elements on the Property of Sn-Ag-Cu Lead-Free Solder
在线阅读 下载PDF
导出
摘要 以Sn-3.0Ag-0.5Cu(质量分数,%)焊料为母合金,探讨了微量稀土元素Ce、Er、Y和Sc对Sn-Ag-Cu合金物理性能、润湿性能以及力学性能的影响。试验结果表明:稀土元素对焊料的性能有不同的影响,添加微量Ce元素可以更好地改善焊料综合性能。 Study is made of the influence of RE elements of Ce,Er,Y and Sc on the physical property, wetting property and mechanical property of Sn-Ag-Cu alloy with Sn-3.0Ag-0.5Cu-based solder as master alloy. The test results show that rare earth elements would affect in different way the property of the solder. The addition of trace rare earth Ce in the solder can further improve the property.
出处 《稀有金属与硬质合金》 CAS CSCD 2007年第1期27-30,共4页 Rare Metals and Cemented Carbides
关键词 无铅焊料 Sn—Ag—Cu 稀土元素 性能 lead-free solder Sn-Ag-Cu rare earth elements property
  • 相关文献

参考文献7

二级参考文献48

  • 1马柏生,刘或,孙强金.稀土对Zn-Al合金组织和性能的影响[J].兵器材料科学与工程,1990,13(2):59-63. 被引量:4
  • 2[1]Mulugeta Abtew, Guna Selvaduray. Lead-free Solder in Microelectronics[J]. Mater Sci Eng, 2000,27:95~141
  • 3[2]何风生.铅中毒问题需彻底解决[N].北京晚报,2002-07-15
  • 4[3]Shina S, Be]base H, Walters K et al. Design of Experiments for Lead-free Materials,Surface Finishes and Manufacturing Processes of Printed Wiring Boards [D].Chicago:America SMTA, 2000
  • 5[4]郭贵庭,宣大荣.无铅焊接技术手册[M].南京:江苏省电子学会SMT专业委员会,2003
  • 6[5]马鑫,钱乙余.无铅化电子组装技术[M].北京:中国电子学会,2004:20~25
  • 7[6]Moon K W, Boettinger W J, Kattner et al. Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloy[J]. Electron Mater,2000,29:1 122~1 236
  • 8[7]菅沼,克昭.无铅焊接技术[M].北京:机械工业出版社,2000
  • 9[8]Anderson I E, Cook B A.2nd EU Lead-Free Soldering Technology Roadmap and Framework for an International Lead-Free Soldering Roadmap[J]. Soldertec at Tin Technology,2003, (2) :78~84
  • 10Wang L, Yu D Q, Zhao J,et al. [J]. Mater Lett,2002, 56:1039-1042.

共引文献53

同被引文献146

引证文献13

二级引证文献62

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部