摘要
介绍了AlN基片所用厚膜浆料的产品性能。从金属粉体的制备,粘结方式探索和烧结工艺的改进等方面综述了该领域的研究进展。目前粉体制备还是以化学还原为主。粘结方式中,玻璃相粘结具有较高的可靠性;反应粘结因导热性和热应力等方面的优势,使其成为AlN基板厚膜浆料粘结的重要方式。
The performance of thick film paste for AlN substrate was summarized, relating to manufacture of metallic powder, study of bonding manner and improvement on firing process. Currently, metallic powder was prepared mostly by chemical reduction. Although the reliability of the frit-bonding system is higher than others, the reaction-bonding system has advantages of higher thermal conduction and lower thermal stress. Reaction-bonding method will be an important method of bonding in thick film paste for AlN substrate.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第3期5-8,共4页
Electronic Components And Materials
关键词
电子技术
厚膜浆料
综述
ALN基板
金属粉体
粘结方式
烧结工艺
electron technology
thick film paste
review
AlN substrate
metallic powder
bonding manner
firing procedess
