摘要
随着微波多芯片组件密度的不断提高,微波互连的不连续性成为制约其整体性能的瓶颈。从垂直互连通孔入手,介绍了垂直通孔互连的矩阵束矩量法、时域有限差分法、边基有限元法以及微波网络模型法和CAD模型法,分析了这些方法已经取得的结果,并指出了这些方法的优缺点。通过比较分析,认为时域有限差分法和边基有限元法是分析互连通孔最有优势的方法。
With the increasing density of multi-chip module, the discontinuity of microwave interconnect was the choke point which restrains its integral performance. From the point of vertical interconnect via, the matrix pencil moment method, FDTD, edge-element FEM, microwave network model method and CAD model method of vertical via interconnect were introduced. The analysis of these methods shows their advantages and shortcomings. The conclusion comes that FDTD and Edge-element FEM are better than others in analysis interconnect via.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第3期1-4,共4页
Electronic Components And Materials
基金
甘肃省自然科学基金资助项目(3ZS061-A25-058)
甘肃省高等学校研究生导师科研计划资助项目(0511-02)
关键词
电子技术
微波多芯片组件
综述
垂直互连
通孔
散射参数
electron technology
microwave multi-chip module （MMCM）
review
vertical interconnect
via
scattering parameter
