摘要
本文对波峰自动焊接中印制板的焊盘、焊盘孔、印制导线及其形状、尺寸以及分布等设计指标和参数作了较详细的分析.同时对印制电路板焊后清洗工艺中清洗剂的选择和清洗步骤作了简介.
This paper analyzes design targets and parameters of pad, pad hole, PC wire, shape, size and arrangement in automatic wavecrest soldering of PCB in detail. At the same time the selection or cleaner and the steps of cleaning of PCB after the soldering the deseribed simply.
出处
《电讯技术》
北大核心
1990年第3期42-47,共6页
Telecommunication Engineering
关键词
印制版
焊接
设计
清洗
工艺
Electronic Technology
Design of PCB
Cleanig Technology
