摘要
本文提出了一种在商品化的SG4009玻璃上制作50×50 mm微流控芯片的方法。SG4009玻璃表面有厚度570 nm的光刻胶S-1085和厚度145 nm的Cr层组成的掩蔽层,省去制作掩蔽层的时间和设备,降低了生产成本,缩短了生产周期。对芯片制作过程中的一些问题进行分析研究,提出相应的解决方案,保证了芯片的制作质量。
A practical process to fabricate microfluidic chip with commercialized SG4009 glass is presented. On the surface of SG4009 glass, there are masking layers, which are Cr with thickness of 145nm and the S -1085 photoresist with thickness of 570 nm. The sputtering before photolithograph is avoided, which decreases the cost and shortens the production cycle. Some critical problems in the process of chip production have been discussed, and the solutions are propesed accordingly. Therefore, the bonding quality is significantly improved.
出处
《分析科学学报》
CAS
CSCD
2006年第6期671-674,共4页
Journal of Analytical Science
基金
国家863高技术研究发展计划MEMS重大专项(No.2004AA404260)
