摘要
本文研究目的是制备一种与RB-SiC反射镜镜坯材料力学、热学性能匹配的高断裂韧性的镜框等光学构件材料(SiC(w)/SiC)。利用反应烧结法制备了SiC晶须增强SiC陶瓷复合材料(SiC(w)/SiCCMC)。测试了SiC(w)/SiC复合材料的主要力学性能和热学性能。结果表明,采用反应烧结法制备的SiC(w)/SiC复合材料具有良好的综合性能,其弯曲强度为243MPa;裂韧性值(KIC)从4.49MPa.m1/2提高到6.43MPa.m1/2,提高了43.2%;其热导率(125.3W/m·K)与RB-SiC陶瓷(119.3W/m·K)的热导率接近。初步探讨认为,SiC晶须的拔出、桥连现像和新生纳米SiC颗粒的存在是SiC(w)/SiC复合材料的主要增韧机理。
To manufacture a kind of high fracture toughness SiC（w）/SiC composite optomechanical component material （SiC ceramics reinforced by SiC whisker） with suitable mechanics property and thermal property to the SiC mirror material prepared by reaction bonded （RB） method is presented in this article. The manufacture method of SiC（w）/SiC composite material was RB technique. The main mechanics property and thermal property of the SiC（w）/SiC CMC was tested. The results indicate that the SiC（w）/SiC composite materials has perfect synthesis properties. The bending strength is 243 MPa. The fracture toughness increased from 4.49MPa.m^1/2 to 6.43MPa.m^1/2, which increase 43.2%. The thermal conductivity of SiC（w）/SiC CMC is 125.3W/m·K, and it is consistent with the thermal conductivity of the RB-SiC mirror material which is 119.3 W/m·K.. Preliminary discussion consider that the SiC whisker pull-out, bridging phenomena and the new SiC groin with nanometer size are the main toughening mechanism of this kind of composite material.
出处
《光电工程》
EI
CAS
CSCD
北大核心
2006年第12期132-135,140,共5页
Opto-Electronic Engineering
