摘要
With the recent advent of deep submicron technology and new packing schemes, the components in the integrated circuit are often not rectangular. On the basis of the representation of Corner Block List （CBL）, we propose a new method of handling rectilinear blocks. In this paper, the handling of the rectilinear blocks is simplified by transforming the L/T- shaped block problem into the Mign-abutment constraint problem. We devise the block rejoining process and block alignment operation for forming the L/T-shaped blocks into their original configurations. The shape flexibility of the soft blocks, and the rotation and reflection of L/T-shaped blocks are exploited to obtain a tight packing. The empty rooms are introduced to the process of block rejoining. The efficiency and effectiveness of the proposed method are demonstrated by the experimental results on a set of some benchmark examples.
With the recent advent of deep submicron technology and new packing schemes, the components in the integrated circuit are often not rectangular. On the basis of the representation of Corner Block List （CBL）, we propose a new method of handling rectilinear blocks. In this paper, the handling of the rectilinear blocks is simplified by transforming the L/T- shaped block problem into the Mign-abutment constraint problem. We devise the block rejoining process and block alignment operation for forming the L/T-shaped blocks into their original configurations. The shape flexibility of the soft blocks, and the rotation and reflection of L/T-shaped blocks are exploited to obtain a tight packing. The empty rooms are introduced to the process of block rejoining. The efficiency and effectiveness of the proposed method are demonstrated by the experimental results on a set of some benchmark examples.
基金
This work is supported by the National Natural Science Foundation of China （Grant Nos. 60473126 and 90407005）, National Natural Science Foundation of China and Hong Kong RGC Joint Project （Grant No. 60218004） and the Hi-Tech Research ＆ Development 863 Program of China （Grant Nos. 2004AA1Z1050 and 2002AA1Z1460）.
