摘要
制备了挠性印制电路中铜箔与聚酰亚胺基材间的聚酰亚胺粘接材料,由醚酐、脂肪族二胺和4,4’-二氨基二苯醚(ODA)或杂环芳香二胺共聚得到的聚酰亚胺薄膜的成膜性很好。通过红外分析,含ODA聚酰亚胺和含杂环聚酰亚胺薄膜已酰亚胺化完全。其力学性能较好。通过DSC分析,含ODA聚酰亚胺的玻璃化转变温度为141℃,结晶熔融温度为212℃;含杂环聚酰亚胺的玻璃化转变温度为136℃,并在225℃出现了一个吸热峰。采用含ODA或杂环聚酰亚胺胶粘剂制备的双面挠性印制电路基板的平均剥离强度为828．66N／m及710．98N／m。
Hot melt polyimide adhesives applied for flexible printed circuit board were prepared with 4,4＂- oxydiphthalic anhydride （ODPA）, 1,6-hexamethylenediamine,4,4＂-oxydianiline （ODA） or heterocyclic diamine. Glass transition temperatures of polyimide containing ODA and polyimide containing heterocyclic diamine were characterized by DSC which were 141℃ and 136℃ respectively. DSC revealed that crystal melting temperature of them were 212℃and 225℃respectively.For PI films,tensile strength,tensile modulus were high. The peeling strength of double-sided flexible printed circuit board were 828.66N/m and 710.98N/m.
出处
《中国胶粘剂》
CAS
2006年第11期18-21,共4页
China Adhesives
关键词
热熔胶
聚酰亚胺
挠性印制电路
hot melt adhesive
polyimide
flexible printed circuit board
