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Fe_(78)B_(13)Si_9熔体与铁的润湿行为 被引量:3

Wetting behavior of Fe_(78)B_(13)Si_9 melt on iron
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摘要 采用座滴法研究了真空条件下1180~1220℃之间Fe78B13Si9熔体在纯铁上的润湿行为,结合DeGennes液滴润湿动力学模型分析了Fe78B13Si9熔体在纯铁上的润湿动力学。结果表明:Fe78B13Si9熔体与铁间有良好的润湿性,平衡接触角在10°~40°之间;Fe78B13Si9熔体与铁的润湿为反应性润湿,润湿过程中由于熔体与基体之间的溶解和相互扩散,熔体体积首先增大,然后随着熔体等温凝固的进行又逐渐减小;由于熔滴体积在润湿过程中不断变化,以及测量接触角与实际接触角的差异,DeGennes液滴润湿动力学模型不能描述Fe78B13Si9熔体在铁基体上的铺展规律。 The wetting behavior of Fe78B13Si9 molten on iron was studied by the sessile drop method in vacuum between 1 180 and 1 220 ℃. Wetting dynamics of Fe78B13Si9 molten on iron was analyzed using De Gennes wetting dynamics model. The results show that there is a good wettability in Fe78B13Si9 mohen/Fe wetting system between 1 180 and 1 220 ℃. The equilibrium contact angle is 10°- 40°. The wetting of Fe78B13Si9 molten on Fe is a reactive wetting. The dissolution and diffusion between molten and substrate result in an increase of the drop volume at the first wetting stage. The volume of drop decrease, in the following stage because of the isothermal solidification of molten. Due to the change of drop volume and discrepancy between measured contact angle and actual value, the wetting dynamics of Fe78B13Si9 molten on iron is out of accordance with De Gennes wetting dynamics model.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2006年第10期1660-1664,共5页 The Chinese Journal of Nonferrous Metals
基金 国家重点基础研究发展规划资助项目(G2000067201)
关键词 FE78B13SI9 润湿 液/固界面 扩散 溶解 Fe78B13Si9 wetting liquid/solid interface diffusion dissolution
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  • 1Gale W F, Orel S V. Microstructural development in NiAl/Ni-Si-B/Ni transient liquid phase bonds [J].Metall Mater Trans A, 1996, 27A:- 1925 - 1931.
  • 2Gale W F, Wallach E R. Microstructural development in transient liquid-phase bonding [J]. Metall Trans A, 1991, 22A: 2451-2457.
  • 3Gale W F, Abdo Z A M. Bulk-alloy microstructural analogues for transient liquid-phase bonds in the NiAl/Cu/Ni system [J]. Metall Mater Trans A,1999, 30A: 3111-3124.
  • 4Shirzadi A A, Wallach E R. Temperature gradient transient liquid phase diffusion bonding: a new method for joining advanced materials [J]. Science and Technology of Welding and Joining, 1997, 2(3): 89 - 94.
  • 5Khan T I, Wallach E R. Transient liquid phase diffusion bonding and associated recrystallization phenomenon when joining ODS ferritic superalloys [J]. Journal of Materials Science, 1996, 31:2937 - 2943.
  • 6MacDonald W D, Eagar T W, Cieslak M J, et al.Transient liquid phase bonding processes [A]. The Metal Science of Joining, the Minearals [C]. TMS Warkendale Penn: Metals & Materials Society, 1992.93 - 100.
  • 7Kim J J, Park J W, Eagar T W. Interface microstructure of partial transient liquid phase bonded Si3 N4-to inconel 718 joints [J]. Mater Sci Eng A, 2003, 344A:240 - 244.
  • 8Zhang J X, Chandel R S, Chen Y Z, et al, Effect of residual stress on the strength of an alumina-steel joint by partial transient liquid phase(PTLP) brazing [J].Journal of Materials Processing Technology, 2002,122: 220 - 225.
  • 9Gale W F, Orel S V. A microstructural investigation of NiAl/Ni-Si-B/NiAl transient liquid phase bonds[J]. Journal of Materials Science, 1996, 31:345 -349.
  • 10Gale W F, Guan Z. Transient liquid-phase bonding in the NiAl/Cu/Ni system-a microstructural investigation [J]. Metall Mater Trans A, 1996, 27A: 3621 -3629.

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  • 2李庆奎,关绍康,钟晖,李荐,钟海云.A binder phase of TiO based cermets[J].Journal of Central South University of Technology,2005,12(4):396-399. 被引量:1
  • 3马广才,李文,李宏,张海峰,胡壮麒.In-Sn合金熔体在非晶和晶态Cu_(46)Zr_(45)Al_7Gd_2合金上的润湿性及界面特性[J].金属学报,2006,42(2):201-204. 被引量:6
  • 4梅志,顾明元,吴人洁.金属基复合材料界面表征及其进展[J].材料科学与工程,1996,14(3):1-5. 被引量:29
  • 5MORTENSEN A. Interfacial phenomena in the solidification processing of metal matrix composites[J]. Mater Sci Eng A, 1991, 135: 1-11.
  • 6KIM Y D, OH N L, OH S T, MOON I H. Thermal conductivity of W-Cu composites at various temperatures[J]. Materials Letters, 2001, 51:420- 424.
  • 7LI L, WONG Y S, FUH J Y H, LU L. Effect of TiC in copper-tungsten electrodes on EDM performance[J]. Journal of Materials Processing Technology, 2001, 113(1/3): 563-567.
  • 8da ALVES F C, da PEREIRA A G S, GOMES U U. The influence of the dispersion technique on the characteristics of the W-Cu powders and on the sintering behavior[J]. Powder Technology, 2003, 134(1/2): 123-132.
  • 9KIM D G, OH S T, JEON H, LEE C H, KIMA Y D. Hydrogen-reduction behavior and microstructural characteristics of WO3-CuO powder mixtures with various milling time[J]. Journal of Alloys and Compounds, 2003, 354(1/2): 239-242.
  • 10DORE F, MARTIN C L, ALLIBERT C H. Apparent viscosity of W-Cu powder compacts during sintering[J]. Mater Sci Eng A, 2004, 383(2): 390-398.

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