摘要
本文用润湿称量法研究了化学镀Ni-P合金层中磷的含量、镀液中次磷酸钠的浓度、络合剂和添加剂的种类、镀液的pH值和温度,以及助焊剂的种类对焊接性能的影响.结果表明,随着镀液中次磷酸钠浓度的升高,pH值的降低、镀液温度的降低、镀层中磷含量的升高,化学镀Ni-P层的钎焊性下降.添加剂和助焊剂的种类对焊接性能有很大影响,添加低浓度的糖精(<1.5g/1)可提高镀层的钎焊性,而加入二乙基二硫代氨基甲酸钠会略为降低钎焊性.在试验的三种助焊剂中,普通松香和溴化水杨酸改性松香焊剂(SD)不适于Ni-P层的焊接,只有YH-61水溶性焊剂才适于化学镀Ni-P层的焊接.
Factors influencing the solderability of electroless Ni-P alloy film were studied by meniscogramm method. The results show that the solderability of Ni-P alloy film is decreased with the increase of P% in the film and the concentration of sodium hypophosohite of the bath, and with the decrease of pH value and temperamre of the bath, and that the kind of complexing agent does not influence the solderability of Ni-P film. Additives and fluxes have great effect on the solderability of the film. Saccharine in low concentration can increass the solderability, while sodium diethyldithiocarbamate can decrease the solderability slightly. Among the three kinds of experimental fluxes the water soluble YH-61 flux is the best flux for Ni-P alloy film, but rosin fluxes of nonactive and modified by bromo-salicylic acid are not suitable for soldering of Ni-P alloy film.
出处
《电镀与精饰》
CAS
1990年第6期3-6,8,共5页
Plating & Finishing
