摘要
对焦磷酸盐镀铜的前处理、预镀、焦磷酸盐镀铜的工艺配方、操作条件及原理、镀液的配制、镀液成分及其作用、操作条件对镀层的影响、镀液的维护、杂质的影响及其排除方法、镀液成分失调的影响与纠正、磷酸根对镀液和镀层的影响、铜粉的产生及其排除、常见故障及其排除方法等都作了详细阐述。此外,对镀铜液中磷酸根和焦磷酸根的分析方法以及不合格铜层的退除也作了一定的介绍。
The processes for electroplating of copper in a pyrophosphate bath were elucidated in details with respect to the pretreatment, pre-plating, bath formulation, plating conditions and principle, preparation of plating bath, bath composition and action of each ingredient, effect of operating conditions on the performance of the copper coating, maitainance of the plating bath, effect of the impurities and the methods to remove the impurities, effect of maladjustment of bath composition and correction, effect of phosphate radicle on the bath stability and coating performance, generation and removal of copper powders, and common faults and methods for troubleshooting. At the same time, the methods to analyze phosphate and pyrophosphate radicles in the plating bath and that to remove unqualified copper coating were briefed as well.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第10期58-66,共9页
Materials Protection
关键词
焦磷酸盐
镀铜
预镀
工艺
故障排除
pyrophosphate
copper electroplating
pre-plating
process
troubleshooting
