摘要
借助扫描电镜和电子探针,分析了金刚石与Ag-Cu-Ti活性钎料界面反应层的微观组织结构、界面新生化合物的形成机理以及焊接工艺条件对界面结构的影响,建立了钎焊接头界面结构物理模型。结果表明,在一定的钎焊工艺条件下,金刚石/钎料界面存在灰色的新生化合物TiC,与TiC相邻的是蜂窝状的TiCu相;接头断裂不仅仅发生在TiC相中,有时断裂也发生在TiCu层。钎焊加热温度、保温时间、钎料层的含Ti量对CVD金刚石厚膜与硬质合金的接头结构模型有重要影响。
The research object of this paper is the brazed CVD diamond thick film and cemented carbide using a Ag-Cu-Ti active filler alloy.The morphology and microstructure of the joint were investigated by scanning electron microscope and electronic probe micro-analysis.The new compound formed in the interface and the influence of brazing parameter on it was analyzed.The microstructure physical model of the joint was suggested.Results show that a gray interfacial reaction layer TiC is formed between filler metal and diamond under a certain brazing condition.TiCu reaction layer near TiC exists in the interface.Fracture often occurs in the reaction layer TiC,sometimes,it occurs in the TiCu layer also.Heating temperature,holding time and the composition of Ti in the active filler alloys effect the microstructure physical model of the joint between CVD diamond thick film and cemented carbide.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2006年第9期70-72,共3页
Transactions of The China Welding Institution
