摘要
采用原子嵌入势,用元胞自动机方法模拟了铁(001)面上的薄膜生长。研究了溅射原子的沉积、迁移扩散和再蒸发3个主要的过程。发现溅射功率和基底温度对薄膜表面所形成岛核的形态影响很大,定量计算了当溅射功率和基底温度变化时岛的均匀度。给出了对于实验有指导意义的结论。
Based on Embedded Atom Method （EAM} theory, Fe thin film growth with bcc structure, was simulated using Cellular Automata （CA） method on Computer. In our model, three processes were considered： particle deposition, adatom diffusion and adatom reevaporation. The simulation showed that the island morphology of the film surface was greatly affected by sputtering power and substrate temperature. The islands uniformity at different temperature and sputtering power has been calculated. The results could be used as useful guide line for thin film deposition experiments.
出处
《信息记录材料》
2006年第5期39-42,46,共5页
Information Recording Materials
基金
国家自然科学基金资助项目(60571010)
关键词
元胞自动机
原子嵌入势
Fe薄膜生长
Cellular Automata （CA）
Embedded Atom Method （EAM）
Fe thin film growth
