摘要
研究了化学还原-机械球磨制备电磁屏蔽用低松比片状银粉的生产工艺,确定了各工序主要影响因素的优化条件。用激光粒度分布仪、SEM、比表面测定仪及松装比测定装置对所制产品进行了表征。结果表明:所制超细银粉和片状银粉平均粒径、松装密度、比表面积分别为:1.0μm和13.5μm、1.7g/cm3和0.4g/cm3、0.8m2/g和1.8m2/g。用所制银粉生产的电磁屏蔽漆具有电阻小,屏蔽效能高等优点。
Production technology for preparation of low apparent density flake silver power by chemical reduction and mechanical milling was studied, of which was established optimize condition of the main effect factors in every technology processing. The powder was characterized by the laser size distribution apparatus, SEM, specific surface area instrument of ASAP--2000 and the apparent density apparatus. The results indicate that the average particle size, apparent density and specific surface area of ultrafine silver powder and flake silver powder are 1.0 μm and 13.5 μm, 1.7 g/cm^3 and 0.4 g/cm^3, 0.8 m^2/g and 1.8 m^2/g, respectively. A lot of advantages are brought from the electromagnetic shielding coatings which are made from this powder, such as the lower resistance, the higher electromagnetic shielding efficiency and so on.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第10期62-64,共3页
Electronic Components And Materials
关键词
电子技术
电磁屏蔽
超细银粉
片状银粉
低松比
制备
eletronic technology
electromagnetic shielding
ultrafine silver powder
flake silver powder
low apparent density
preparation
