摘要
论述了ＳｉＣｐ／Ｎｉ－Ｐ复合镀层与钢基体的结合强度及其影响因素。复合镀层中离界面５μｍ厚度以内区域的组成及应力状态对镀层／基体的界面结合有决定性作用，在该区域以外ＳｉＣ粒径变化不影响镀层的结合强度。适当的热处理可提高界面结合力。
The interfacial bonding strength and its influential factors between the electroless SiCp/Ni-P composite coatings and steel substrate are investigated in this paper.It is found that the component and stress status in the layer 5μm thick over the coating/substrate interface play a dominant role in controlling the interfacial bond,Beyond this layer, the change of SiCp sizes has no influence on the bond.An appropriate heat treatment can improve the bond.
出处
《材料工程》
EI
CAS
CSCD
北大核心
1996年第8期26-28,共3页
Journal of Materials Engineering
关键词
结合强度
复合镀层
化学镀
镍-磷
陶瓷粒
s: interfacial bonding
influential factors
SiCp /Ni-P composite coating
electroless plating
