摘要
FA/O螯合剂是一种具有1 3个螯合环的新型螯合剂,不含钠离子,并且易溶于水,稳定性好。通过对FA/O螯合剂在RCA标准清洗SC1、SC2溶液中的应用,对XPS的测试结果分析表明,FA/O螯合剂对Fe和Cu的络合能力比NH4OH的络合能力强,RCA标准清洗液中加入少量FA/O螯合剂就可使硅片表面微量铜、铁等金属污染物的去除效果显著增加。对清洗工艺的研究表明,在有螯合剂存在下,清洗温度控制在7 0℃,清洗时间为5 min.2次,效果更好。
FA/O, a new kind of chelating agent was studied in RCA cleaning solutions, which has 13 chelating rings and is free of sodium, stable and easily soluble. The XPS results indicate that FA/O is better than NH4OH as a ligand. Cu and Fe contaminations on silicon wafer can be removed remarkably when adding little FA/O. The cleaning process conditions were also studied, 70℃ and 5 min × 2 may be the best.
出处
《电子器件》
EI
CAS
2006年第3期663-665,671,共4页
Chinese Journal of Electron Devices
关键词
FA/O螯合剂
硅
清洗
金属污染物
FA/O chelating agent
metal pollution
silicon wafer
cleaning
