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Semiconductor Yield Analysis and Multi-Chip Package(MCP) Dic Pairing Optimization using Machine Learning

Semiconductor Yield Analysis and Multi-Chip Package(MCP) Dic Pairing Optimization using Machine Learning
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出处 《电子工业专用设备》 2006年第8期I0001-I0010,共10页 Equipment for Electronic Products Manufacturing
关键词 STATISTICS machine learning data mining OPTIMIZATION statistics, machine learning, data mining, optimization
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参考文献5

  • 1Tuv, E., Runger, G., "Pre-Processing of High-Dimensional Categorical Predictors in Classification Settings," Applied Artificial Intelligence 17(5-6): 419-429,2003.
  • 2Borisov, A., Eruhimov, V., and Tuv, E., "Flexible Ensemble Leaming with Dynamic Soft Feature Selection," forthcoming chapter in Feature Extraction,Foundations and Applieations, editors: I. Guyon, S. Gunn,M. Nikravesh, and L. Zadeh, Springer, New York, 2004.
  • 3Torkkola, K. and Tuv, E., 2004 "Ensembles of Regularized Least Squares Classifiers for High Dimensional Problems," forthcoming chapter in Feature Extraction, Foundations and Applications, Editors: I.Guyon, S. Gunn, M. Nikravesh, and L. Zadeh, Springer,New York, 2004.
  • 4Fayyad, U., Piatetsky-Shapiro, G. and Padhraic Smyth, "From Data Mining to Knowledge Discovery: An Overview," Chapter 1 in Advances in Knowledge Discovery and Data Mining, pages 1-34, AAAI Press, 1996.
  • 5E. Tuv, Invention Disclosure 46548: A Method for Selecting a Rank Ordered Sequence Based on Probabilistic Dissimilarity Matrix, Mar 2006

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