摘要
便携式电子产品市场正在被更小、更薄和更轻的产品所驱使着,如移动电话、摄像机、CD和掌上电脑等。为了能够进一步地提高这些产品的性能,表面贴装技术己经发生了很大的变化。新的导电粘接材料正在被开发,以求能替代传统的焊料产品。
The portable electronics market is being driven by smaller, thinner and lighter products such as cellular phones, video cameras, CDs and palmtop computers. To improve performance of these products, surface mount technology has been changing drastically. New conductive adhesive materials are being developed to compete with traditional solder products with varying degrees of success.
出处
《印制电路信息》
2006年第8期64-67,共4页
Printed Circuit Information
关键词
表面贴装器件
导电粘接
电子组装
surface mount devices conductive adhesive electronic packaging
