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Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing 被引量:1

Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing
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摘要 Microbridge testing was used to measure the Young's modulus and residual stress of metallic films. Samples of freestanding NiFe film microbridge were fabricated by microelectromechanical systems. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curve of NiFe film microbridge by the Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of load-deflection curves of the microbridges was proposed to evaluate the Young's modulus and residual stress of the films simultaneously. The calculated results based on experimental measurements show that the average Young's modulus and residual stress for the electroplated NiFe films are 203.2 GPa and 333.0 MPa, respectively, while the Young's modulus measured by the Nano-hardness method is 209.6:1:11.8 GPa for the thick NiFe film with silicon substrate. Microbridge testing was used to measure the Young's modulus and residual stress of metallic films. Samples of freestanding NiFe film microbridge were fabricated by microelectromechanical systems. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curve of NiFe film microbridge by the Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of load-deflection curves of the microbridges was proposed to evaluate the Young's modulus and residual stress of the films simultaneously. The calculated results based on experimental measurements show that the average Young's modulus and residual stress for the electroplated NiFe films are 203.2 GPa and 333.0 MPa, respectively, while the Young's modulus measured by the Nano-hardness method is 209.6:1:11.8 GPa for the thick NiFe film with silicon substrate.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2006年第3期345-348,共4页 材料科学技术(英文版)
基金 Key Fundamental Research and Development Program (G1999033103) partly supported bY the National Natural Science Foundation of China under Grant Nos. 50275096 , 10402023 the Nanometer Technology Program of Science and Technology Committee of Shanghai (0215 nml04 , 0352 nm014), Postdoctoral Science Foundation of China (No. 20040350476) the Doctoral Training Foundation of National Education Commission of China.
关键词 Mechanical properties Metal thin film NANOINDENTATION Mechanical properties Metal thin film Nanoindentation
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