摘要
介绍了溅射法镀膜的基本原理,阐述了溅射法镀二氧化钛薄膜用靶材及相应溅射镀膜工艺的研究现状。溅射镀TiO2薄膜用靶材主要有金属钛、二氧化钛和“非化学计量”二氧化钛靶材3大类。由于钛的氧化态及靶材导电性不同,它们对溅射工艺(如溅射气氛等)有一定具体的要求,通过对靶材和相应工艺进行分析比较,指出应用“非化学计量”靶材是溅射法制备二氧化钛薄膜技术发展的重要方向。
The basic principle of sputtering was presented, and the targets and techniques used in the preparation of titania thin film from sputtering were reviewed and discussed. The targets used in sputtering are mainly Ti, TiO2 and TiO2-x with different oxidation states and electric properties, they have special demands for the technical condition such as the atmosphere gas. The sputtering targets and corresponding techniques were analyzed and compared. At last it was pointed out that sputtering method using sub-stoichiometric compound as targets is one of the most promising techniques to deposit titania thin film.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2006年第2期177-180,共4页
Chinese Journal of Rare Metals
基金
国家863计划项目(2003AA327040)
关键词
溅射
靶材
二氧化钛薄膜
sputtering
targets
titania thin film
