摘要
提出了一种光纤光栅(FBG)的Ti合金片的封装工艺,实验和理论研究了FBG的应变和温度传感特性。与裸FBG的测试结果相比,Ti合金片封装工艺基本不改变FBG应变传感的灵敏度,但是温度灵敏度系数提高了1.76倍。经过Ti合金片封装后的FBG可以探测到1με和0.05℃。
The titanium alloy slice packaging technique for fiber Bragg grating（FBG） sensor was developed in consideration of bare optical fiber being fragility, and the strain and temperature characteristics of the packaged FBG sensors were experimentally and theoretically studied. Compared with the experimental results of the bare FBG, the strain sensing property of the FBG sensor packaged by the titanium alloy slice is nearly the same as that of the bare FBG, however the temperature sensing ability of the packaged FBG sensor is improved and the temperature sensitivity coefficient is 1.76 times larger than that of the bare FBG. The strain and temperature resolution of the packaged FBG sensor are 1 με and 0.05℃.
出处
《光电子．激光》
EI
CAS
CSCD
北大核心
2006年第5期564-567,共4页
Journal of Optoelectronics·Laser
关键词
光纤光栅(FBG)
封装工艺
应变传感
温度传感
fiber Bragg grating（FBG）
packaging technique
strain sensing
temperature sensing
