摘要
对无铅焊接和有铅焊接的外观进行了比较,分析了无铅焊接的优缺点,阐述了自动光学检测系统的工作原理及其检测中的问题,讨论了焊接无铅化对自动光学检测系统的影响,并提出了相应的改进方法。
It mainly compares the appearance of the Sn-Pb jointing and the lead free jointing, analyzes the advantages and disadvantages of the lead- free jointing, explains the work principles of automated optical inspection system（AOI） and its problems in inspecting, discusses the impact of the lead- free solder on AOI and puts forward the corresponding improvement methods.
关键词
自动光学检测
印刷电路板
无铅焊接
数字图像处理
Automated Optical Inspection（AOI）
PCB
Lead - free Jointing
Digital Image Processing
