摘要
讨论金属基体、镀后处理、阴极电流密度等对镀层质量的影响,并就滚桶型号和转速的确定,添加剂的选用和补加,硫酸含量的控制,阳极和阴阳极面积比等问题介绍了笔者在在生产中的体会。
This paper discusses the effect of metallic metrix, post-treatment of plating and cathodic current density etc. on the plating quality, and the auther introduces his own experiences in the production about the model of roller, the definition of rotating speed, the selection of additives and supplement as well as about the sulfuric acid content, the ratio of anodie and cathodic earns etc.
出处
《表面技术》
EI
CAS
CSCD
1990年第3期41-44,共4页
Surface Technology
