期刊文献+

应用高频气力分选机分选电子废料碎片的研究 被引量:7

A new way of splitting the electronic scraps by using high-frequency-vibration-air separator
在线阅读 下载PDF
导出
摘要 进行了实验室高频气力分选机分选3~0.3mm印刷电(线)路板模拟物料的研究。结果表明,在振频为1621次/min,上升风量为120m3/h,95m3/h,60m3/h,床面横向倾角6.64°,纵向倾角为1.07°时,金属回收率达93.95%;重产物金属品位为89.19%;轻产物中非金属的品位达99.33%。0.5~0.3mm细粒物料的分选效果也是令人满意的。 The present paper aims to introduce the authors' newly developed method for splitting the Printed Circuit Boards (PCB) scraps in hoping to reduce the waste pollution caused by the electronics wastes. As is known, the wasted printed circuit board (PCB) scraps have become a kind of public harm with each passing day, which has made it an urgent task to find new ways to properly treat them by recycling their use not only in China but also in the world. Research has been done by using high-frequency-vibration-air separator in a laboratory scale to separate 3-0.3 mm man-made material. For the better simulation of PCB scraps, the man-made material made of copper, iron, aluminum as well as rubber is used. At the same time, their constituent ratio is also simulated to make them similar to the ratio of PCB scraps. The test equipment the author of this paper adopted is high-frequency-vibration-air separator, which are used to separate materials of high density. The main adjustment parameters are the frequency, the inclining angle and the flow of air. Our test results have shown that the grade and recovery of metal and nonmetal products are so high that the grade and recovery of metals and nonmetals can reach 89.19 % and 99.33 % respectively while the recovery of metals can be as high as 93.95 %. However, when copper and iron mix into heavy products and the quantity of aluminum content may only account for 0.67 % in the light product, most of the aluminum would distribute in the heavy products, whose proportion of aluminum takes only 16% in the intermediary products. The size may seem to influence the separation effect. But when the size is reduced, it would be difficult to do more splitting. Nevertheless, for the size of 0.5-0.3 nun fine material, the grade and recovery of metals are 85.71% and 96.01% respectively, the separation result is satisfactory.
出处 《安全与环境学报》 CAS CSCD 2006年第2期23-25,共3页 Journal of Safety and Environment
关键词 环境工程 印刷电(线)路板 PCB 高频气力分选机 干法分选 environmental engineering printed circuit ( wiring ) board (PCB) high-frequency-vibration-air separator dry-separation recovery
  • 相关文献

参考文献5

  • 1LUMaixi(路迈西) ZHOUCuihong(周翠红) PANYongtai(潘永泰) etal.Study on recovering waste printed circuit board by mechanical method[J].环境污染与防治,2004,10(5):1-5.
  • 2DE F T L,DELCHAMBRE A,DE L P.Disassembly for recycling of office electronic equipment[J].European Journal of Mechanical Engineering,1997,42(1):25-31.
  • 3ZHANG Shunli,FORSSBERG E.Electronic scrap characterization for materials recycling[J].Journal of Waste Management & Resource Recovery,1997,3(4):157-167.
  • 4ZHANG Shunli,FORSSBERG E.Mechanical recycling of electronics scrap the current status and prospects[J].Waste Management &Research,1998,16(2):119-128.
  • 5王晖,顾帼华.报废电子器件处理技术进展[J].环境污染与防治,2003,25(4):218-221. 被引量:7

二级参考文献25

  • 1王志强.电脑垃圾汹涌而来[N].潇湘晨报,2001.10.21:A3.
  • 2Hentschel C. Greening of products and production-a new challenge for engineers. IFIP Transactions B: Computer Applications in Technology, Elsevier Science Publishers, 1993,9 : 39-46.
  • 3Mcadams C. Resurrecting the computer graveyard. Waste Age,1995,26(2): 3.
  • 4De Fazio T L, Delchambre A, De Lit P. Disassembly for recycling of office electronic equipment. European Journal of Mechanical Engineering, 1997,42(1): 25-31.
  • 5Kreft, Hansjurgen. Electronic scrap: The case for required recycling. Siemens Review, 1993,60(4) :5-6.
  • 6Scheidt L G, Abdoolcader N, Stadlbauer H, et al. Electronics recycling-another dimension. In: Proceeding of the 1995 IEEE international Symposium on Electronics and Environment,IEEE, Piscataway, NJ, USA. 1995. 290-294.
  • 7Shunli Zhang, Eric Forssberg. Electronic scrap characterization for materials recycling. Journal of Waste Management & Resource Recovery, 1997,3(4) : 157- 167.
  • 8Zhang Shunli, Forssberg Eric, Van Houwelingen Jan, et al.End-of-life electric and electronic equipment management towards the 21st century. Waste Management and Research,Munksgaard Int Publ. Ltd, 2000,18(1) : 73-85.
  • 9Rau R. Materialkreislauf yon computerschrotten (Material life cycle of computer scrap). Metall, 1991,45 : 81-82.
  • 10Shunli Zhang, Eric Forssberg. Mechanical recycling of electronics scrap the current status and prospects. Waste Management & Research, 1998,16(2) : 119-128.

共引文献6

同被引文献118

引证文献7

二级引证文献26

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部