摘要
脉冲化学镀是指在化学镀上叠加脉冲电流。本文研究了脉冲电参数(脉冲电流密度与工作比)对镀层的成分、性能和沉积速度的影响。研究结果表明,采用脉冲化学镀可在保持化学镀镍磷合金性能的同时,使沉积速度加快数倍,并发现脉冲电流对自催化的化学沉积镍过程起促进作用。
The superposition of pulsed current on the electroless reaction is referred to the pulsed electroless plating. The effects of pulsed parameters (pulsed current desities and duty cycles) and temperatures on the compositions and performances of deposits and the depositing rates are investigated. The results showed that the depositing rates are accelerated by pulsed current without any great loss in the properties of the Ni-P deposit. In addition, the enhancement of the chemical reaction for electroless nickel deposition by pulsed current is found.
出处
《北京科技大学学报》
EI
CAS
CSCD
北大核心
1990年第2期109-113,共5页
Journal of University of Science and Technology Beijing
关键词
化学镀
脉冲电镀
镍磷合金
沉积
electroless, pulse electroplating, nickel, phosphorus, deposit
