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光电仪器防霉防雾包装研究 被引量:1

Researches on Antimold and Antifogging packaging for Electrooptical Instrumentaion
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摘要 分析影响光电仪器生霉起雾的原因,提出采用综合的封存包装方法,通过全面性能评定表明,利用软质铝塑复合袋的干燥空气封存或同时采用防霉剂的综合封存包装方法,能有效地解决中小型光电仪器在长储中的生霉起雾。 Comprehensively preservative packaging has been put forward in this paper due to the mold and foggi- ng present on the electrooptical instrumentation.The overall evaluation shows that the problem about mo- ld.and fogging on middle or small type of eleetrooptical instrumentation in long term storage can be effec- tively solved by means of making use of soft aluminium plastic composite film bag for dry air preservation in addition to the comprehensively preservative packaging with antimold agent.
作者 王公录
出处 《包装工程》 CAS CSCD 1990年第4期19-22,共4页 Packaging Engineering
关键词 光电仪器 防霉 包装 封存 防雾 antimold packaging preservation electrooptical instrumentation
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