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GaAs VHSIC的离子注入和快速热退火的均匀性研究

Investigation of the Uniformity of Ion Implantation and Rapid Thermal Anneling for GaAs VHSIC
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摘要 研究了改变注入角、p型埋层注入及红外快速热退火对GaAsIC有源层均匀性的影响,得到了表面形貌好、大面积均匀性良好的注入掺杂有源层。在2英寸圆片上做出的场效应管无栅饱和电流相对偏差2.3%,器件阈值电压标准偏差98mV。用该材料做出了672门GaAs超高速门阵电路,还做出了工作频率为5GHz的除二动态分频器。 The influences on uniformity of active layer of GaAs IC by changing tilt and rotation angle on implant channeling and p-burried layer implanting and infra-red rapid thermal annealing have been studied in this paper. An active layer with better facial appearance and good uniformity across a large area were attained. The deviation ratio of current and the standard deviation of threshold voltage across 2 inch diameter GaAs are 2.3% and 98mV, respectively. With the material, 672 gates GaAs very high speed gate circuit and a divided-by-two dynamic frequency divider with operation frequency of 5GHzhave been obtained.
机构地区 石家庄电子部第
出处 《半导体情报》 1996年第3期30-37,共8页 Semiconductor Information
关键词 砷化镓 离子注入 快速热退火 GaAs, Ion implantation, Rapid thermal annealing
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