摘要
评述了国内外电子工业中贵金属及其合金镀层、可焊性镀层、化学镀及功能镀等有关方面近期发展及应用情况，并展望了９０年代电子电镀技术的发展动向。
The recent development and application of precious metal and its alloy plating, solderability coatings, electroless plating, and fuctional plating in the electronics industry in 1990' are forecasted.
出处
《半导体情报》
1996年第3期10-18,共9页
Semiconductor Information
关键词
电子电镀
贵金属
合金镀
可焊性镀层
化学镀
Plating in the electronics industry, Precious metal and its alloy plating, Solderability coating, Electroless plating, Fuctional plating
