摘要
本文介绍了新研制出的CL-Ⅱ型超声键合机的主要性能、结构特点及研制结果。本机超声波发生器采用一改进型哈脱莱功率振荡器提供了理想的频率与K·S公司进口的换能器匹配,实现频率自动跟踪,从而保证键合质量的稳定性和可靠性。该机结构紧凑、外形美观、操作方便。该机尤其适用于研究室使用。
The paper describes the main specification, sconstruction features and development of the model CL-Ⅱ ultrasonic bonder. The ultrasonic generator, by means of a modified Hartley power oscillator, provided the desired frequency matched with the resonant characteristics of the transducer imported from Kulicke & Soffa company, and realized the frequency automatic tracking. Therefore the bonding quality and stability can be ensured. The machine is compact and good-looking. It is easy to operate and particularly suitable for laboratories.
出处
《半导体情报》
1990年第2期95-98,共4页
Semiconductor Information
