摘要
芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响.常用FEM模拟在分析此类问题时比较费时且缺乏明确的理论意义.文中基于单元库法思路提出了该类问题的理论建模方法,并依此举例分析了芯片粘接工艺中各可变参数对双端固支梁pull-in电压的影响,其结论与Ansys模拟结果一致.该方法简单准确,对MEMS的封装-器件协同设计将有着实际的意义.
Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices. A cell library method,as an alternative conventional FEM simulation,is introduced here to simplify the package-device co-design and the parametric study of MEMS components. Effects of the die bonding process on the pull-in voltage of a doubly supported micro-beam are predicted using this method, and the results are in good agreement with the FEM calculations. This method has the advantages of simplicity and accuracy and application to the co-design of the overall system of the packaged MEMS devices.
基金
国家重点实验室资助项目(批准号:51433030105JW0601)~~
