摘要
本文介绍在875℃温度下,99%氧化铝陶瓷与无氧铜的无焊料直接接触的一种封接方法.在真空、温度的作用下,陶瓷与金属之间藉助于铜表面本身形成的液相活性合金,润湿陶瓷而获得牢固的连接.该工艺能适用于多个零件与长瓷筒内套封接,因而使激光管的封接简单而方便.
The paper presents a method of direct contact bonding of 99% Al_2O_3 ceramic to copper without brazing filler at 875℃. At vacuum and above mentioned temperature, a firm joint can be formed between ceramic and metal by a active liquid phase alloy formed on copper surfaces to wet ceramic. The process can be applied to bonding multi-metal parts to a long circle ceramic bore. In this way, the laser tube could be sealed easily.
出处
《光电子技术》
CAS
1989年第3期27-29,共3页
Optoelectronic Technology
