摘要
主要介绍贴片胶的特性,在各种工艺下的使用方法及使用中出现的不良与对策,并给出了典型温度曲线以及温度曲线上主要控制点的工艺参数。
The characteristics and different using requirements in various construction processes for acrylate type and epoxy resin type surface mount adhesives were introduced. Moreover, some harmful tendencies and the way to deal with them in using processes were presented. The article introduces typical temperature profile and technical parameter of the main control point at the temperature profile.
出处
《印制电路信息》
2005年第12期63-67,共5页
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