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磁控溅射MoS_2薄膜的生长特性研究 被引量:9

Growth Characteristics of MoS_2 Coatings Prepared by Magnetron Sputtering
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摘要 利用非平衡磁控溅射技术制备出二硫化钼薄膜,并通过扫描电子显微镜和X射线衍射仪研究了工作气压和沉积时间对薄膜表面形貌和结构的影响及其演化规律。实验结果表明,在小于0.40 Pa的气压下,沉积MoS2薄膜的(002)面平行于基体表面,而在高于0.60 Pa的高气压下,膜层的(002)面垂直于基体表面。在沉积初期,无论工作气压的高低,薄膜均按(002)基面的方式生长;在沉积后期,低气压下形成的薄膜仍按(002)基面方式生长,而在高气压下薄膜将转向以(002)基面与(100)或(110)棱面联合的方式生长。薄膜的表面形貌、微观结构,与薄膜的生长速率和沉积粒子的能量有关。 MoS2 coatings were prepared by unbalanced bipolar magnetron sputtering apparatus, and the structure and morphology of MoS2 coatings were measured and observed respectively by X-ray diffraction and scanning electron microscopy. The resuhs show that at the low argon pressures of 0. 15 Pa and 0. 40 Pa MoS2 coating is formed with the (002) basal plane parallel to the surface, whereas the coating deposited at the argon pressure above 0. 60 Pa has the (002) basal plane perpendicular to the surface. At the first stage of coating formation, the (002) basal plane with S-Mo-S layer structure is grown on the substrate whatever the argon pressure is. After that, the coating at 0.40 Pa pressure still grows with the (002) layer structure, but the coating under 0. 88 Pa and 1.60 Pa argon pressures starts to grow with the mixed basal and edge orientations. The morphology and structure of MoS2 coating are highly related to the growth rate of coating and the energy of sputtered particles.
作者 王吉会 杨静
出处 《润滑与密封》 EI CAS CSCD 北大核心 2005年第6期12-14,23,共4页 Lubrication Engineering
基金 教育部留学回国人员科研启动基金资助项目(413175)
关键词 磁控溅射 二硫化钼 薄膜 生长规律 magnetron sputtering molybdenum disulfide coating growth mechanism
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参考文献12

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