摘要
分析了端子模跳屑产生的不同原因,归纳总结了各种解决措施的优缺点,以及各自的应用场合。对端子模设计、制造有较强的指导意义。
Different reasons caused outside chip o and disadvantages summarized, which of various solving can be a guidance steps and its f terminal die are analyzed, the advantages applicable circumstance are classified and to terminal die design and manufacture.
出处
《模具制造》
2005年第11期26-28,共3页
Die & Mould Manufacture
