摘要
半导体在汽车上的应用日渐扩大。在技术快速进步的时代,市场对"在半导体上集成系统"和"在封装里集成系统"的需求日益增长,而"智能电源"技术就是对上述要求一个不错的回应。汽车制造商和电子模块制造商应该能找到更有效的解决方案。从如下几个方面他们有着很大的优势:技术创新、经济实用、坚固可靠以及满足环境规范。由于封装技术连续的技术进步和创新,我们才能够提"在封装里集成系统"这个词,也就是说在一个封装里封装几个不同的硅片。只有这样才允许我们设计真正的机电一体化方案。它就是在同一模块里集成机械的,电气的、电子的以及信息元件。机电一体化解决方案有助于设计者从集中式解决方案过度到分布式解决方案,这有助于功率密度的适当分布以及减小布线。本文讨论了H-桥电源的应用情况,并在传统的方案(中继或离散方案)和单个电源封装里有H-桥功能的新方案之间进行了比较,新方案有保护和诊断功能,并能够给微控制器提供反馈信息。增加热应对措施以优化由SMD封装+PCB构成的系统散热。文章最后提供了电磁兼容(EMI)测试结果并对之进行了讨论,以防止干扰汽车上其他电子系统。
The semiconductor market is gaining ground day by day in the automotive market. In a time of fast technology advancement, ＂Smart power＂ Technologies represent an answer to the everincreasing market demand of System on Silicon and system on package. Carmakers and electronic module makers find a more effective answer to their needs in these state of the art technologies. They in fact offer big advantages in terms of： technological innovation, economic convenience, reliability and respect of the environmental norms. Thanks to the continuous technological improvement and to innovative solution for package we are now allowed to talk about ＂system on package＂, that is, housing different piece of silicon on the same package. This allows us to make concrete the ＂Mechatronic＂ approach. That is a complete integration inside the same module of mechanical, electric, electronic and informatics components. Mechatronic solution helps designer to move from a centralized approach to a distributed one, driving to a well-distributed density of power and a considerable wiringreduction.This paper discusses a power H-Bridge application, and shows a comparison between the traditional solutions（relays or discrete solution） and an innovative one that allows to carry out a complete H-bridge in a single power package; together with protections and diagnostic features able to give feedback to a micro. Thermal consideration will be added so to optimize power dissipation through the system composed by an SMD package ＋ PCB. EMI measurement will be provided and discussed so to prevent any interference with other electronic system present in a car.
出处
《电力电子》
2005年第2期37-41,共5页
Power Electronics
