摘要
讨论了环氧基材PCB对无铅焊锡装配的适应性、铜通孔的可靠性,证明双氰胺固化的环氧基材不能适应无铅焊锡装配;酚醛树脂固化的环氧基材有解决此问题可能性,但都是PCB制造商们的技术决窍.
Talk about Compatibility of Epoxy-based PCBs to Lead-Free Assembly. Through Hole Reliability, Demonstrate that Dicy-cured epoxy base materials cannot withstand the thermal stress of the Lead-Free soldering steps ; the Phenolic-cured epoxy materials have the potential to solve this problem, but only if the PCB manufacturer knows how.
出处
《覆铜板资讯》
2005年第5期12-20,共9页
Copper Clad Laminate Information
