摘要
本文论述了如何运用Pro/E软件进行手机外壳造型,并对其进行可行性分析和工艺分析,然后用PlasticAdvisor软件对塑件进行模流仿真分析,设计出浇注系统和各零部件,最后由EMX软件设计出标准模架的整个流程。
This paper discusses how to design the mobile telephone molding by Pro/E. The feasibility and technology are analyzed. Mold flow emulation is also analyzed with Plastic Advisor. Gating system and other components are designed. Then whole circuit of the classical die carrier is designed with EMX.
出处
《机电工程技术》
2005年第9期40-45,共6页
Mechanical & Electrical Engineering Technology
