摘要
从市场、技术和产业化的角度论述了世界半导体硅材料的发展现状和趋势。主要表现为:半导体行业新的一轮高速发展逐步形成,将极大带动半导体硅材料的发展;单晶硅大直径化稳步推进,300mm渐成主流;伴随着太阳能电池用硅量的增加,多晶硅的供应由过剩转为短缺,但长远看有望逐步达到平衡。
The current situation and development trend of semiconductor silicon materials industry of me wonu are summarized in terms of market, technology and industrialization. The world is experiencing a new round of fast development. Monochrytalline silicon wafers are being produced in ever larger diameters with 300mm diameter wafers as the main product. With the increasing demand for silicon in solar industry, the balance between the supply and the demand for polychrystalline silicon can be achieved.
出处
《上海有色金属》
CAS
2005年第3期145-148,共4页
Shanghai Nonferrous Metals
关键词
半导体
硅
单晶硅
多晶硅
大直径化
semiconductor
silicon
monochrystalline silicon
polychrystalline silicon
ever-larger diameters
