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快速凝固Cu-Cr-Sn-Zn合金的时效强化研究 被引量:4

Ageing Behavior of Rapidly Solidified Cu-Cr-Sn-Zn Alloy
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摘要 研究了时效温度、时效时间对快速凝固Cu-Cr-Sn-Zn合金微观组织、显微硬度和电导率的影响规律。结果表明,快速凝固状态下合金细晶强化作用显著,硬度(HV)和电导率分别为100和20.9MS/m。合金快速凝固时效后的析出相Cr弥散、稠密,使合金强度和电导率得以提高,在500℃×15min时效后,硬度(HV)为170,电导率达37.1MS/m。 Effects of ageing temperature,ageing time on microstructure,micro-hardness and electric conductivity of rapidly solidified Cu-Cr-Sn-Zn alloy were investigated.The micro-hardness and electric conductivity of the alloy are 100 HV and 20.9 MS/s,respectively,due to strengthening effects of fine grain.Aged at 500 ℃ for 15 min,the micro-hardness and electric conductivity are 170 HV and (37.1 MS/m,)respectively,resulted from the precipitated dispersive and intensive Cr phase improving the strength and conductivity of the rapidly solidified alloy.
出处 《特种铸造及有色合金》 CAS CSCD 北大核心 2005年第9期572-574,共3页 Special Casting & Nonferrous Alloys
基金 河南科技大学科研基金资助项目(2004ZJ039) 西北工业大学博士论文创新基金资助项目(CX200409)
关键词 Cu-Cr-Sn-Zn合金 显微硬度 电导率 快速凝固 Cu-Cr-Sn-Zn Alloy,Micro-hardness,Conductivity,Rapid Solidification
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