摘要
本文利用金相显微镜、扫描电镜、透射电镜和X射线衍射技术研究了掺杂钨丝的微观组织变化,同时对不同温度下退火处理的样品进行了抗拉强度、显微硬度和室温内耗的测定。结果表明,掺杂钨丝退火时可分为三个阶段:回复、一次再结晶和二次再结晶。文中提出了亚晶聚合是一次再结晶的主要形核机制的观点。
The microstructural changes of K-Si-Al doped tungsten wire with annealing temperatures wereinvestigated by using OM, SEM, TEM and X-ray diffraction. The tensile strength, microhardnessand room temperature internal friction were measured for the specimens annealed at differenttemperatures. It was suggested that the annealing process was divided into three stages: recovery,primary recrystallization and secondary recrystallization, and that subgrain coalescence was themain nucleation mechanism for primary recrystallization.
关键词
再结晶
钨
显微组织
内摩擦
recrystallization
tungsten
mictostructure
internal friction
