摘要
以蒙脱石和硫酸铜为主要原料,制备载铜蒙脱石。比较载铜前后蒙脱石的晶体结构和表面特性。结果表明:铜主要是以水合阳离子的形式,以离子交换的方式进入蒙脱石晶格层间,还有少量铜以化学吸附的形式进入Si-O四面体和Al-O八面体的微孔中。与蒙脱石相比,载铜后的蒙脱石总比表面积、微孔比表面积、微孔体积减少,而离子交换容量、外比表面积、孔体积和孔径增大。另外,载铜蒙脱石的总电荷、层间电荷、端面电荷和zeta电位的绝对值均低于蒙脱石,表明所载铜降低了粘土矿物质的负电荷。
Copper-loaded montmorillonite was prepared using montmorillonite and copper sulphate as raw materials. The structure and characteristics of copper-loaded montmorillonite were investigated as compared to those of montmorillonite. The results show that most of the loaded copper enters into the interlayer position of montmorillonite in hydrated form by ion exchange with original metal ions, and a small fraction penetrates into the Si--O tetrahedral and Al--O octahedral mi- cro-pores by chemical adsorption. As compared to montmorillonite, the total surface area, micro-pore surface area and micro-pore volume of copper-loaded montmorillonite are reduced, while the cation exchange capacity, external surface area, pore volume and pore diameter are increased. Absolute values of total charge, layer charge, edge charge and zeta potential of copper-loaded montmorillonite are lower than those of montmorillonite, which indicates that the loaded copper can reduce the negative charge of clay.
出处
《硅酸盐学报》
EI
CAS
CSCD
北大核心
2005年第8期1041-1044,共4页
Journal of The Chinese Ceramic Society
基金
国家自然科学基金(30471255)
宁夏大学科学研究基金资助项目。
关键词
载铜蒙脱石
制备
晶体结构
表面特性
copper-loaded montmorillonite
preparations crystal structures surface characteristic
