摘要
本文研究了环氧丙烯酸酯的改性，采用双马来酰亚胺、环氧树脂、丙烯酸酯、改性剂为主要原料合成了改性环氧丙烯酸酯胶粘剂．运用IR、DSC等分析测试手段研究了该胶粘剂的固化行为。运用TGA、DTA等分析手段研究了该胶粘剂固化后的热稳定性．同时，用改性环氧丙烯酸酯胶粘剂制得了聚酰亚胺薄膜挠性印刷电路基板并测试了有关性能．
Bismaleimides, epoxy, acrylate and modifier were used as main materials to modify epoxy acrylate adhesive (MEA), whose curing bebavior was studied by IR and DSC and thermal stability was analyzed by TGA and DTA, Proderties of flexible polyimide film printed circuit board which is prepared from MEA adhesive were also characterized.
出处
《中国胶粘剂》
CAS
1995年第5期1-4,共4页
China Adhesives
关键词
双马来酰亚胺
胶粘剂
合成
环氧丙烯酸酯
改性
Bismaleimides
epoxy
acrylate adhesive
adhesive for flexible polyimide film printed circuit board
