摘要
本文采用双酚A或双酚F型环氧树脂、胺类固化剂，改性叔胺固化促进剂，阻燃性填料配制成软片装黑胶—FZ—101黑胶，进行了固化温度和时间以及贮存期等试验，同时于美国同类产品HysolE01016胶进行比较．
FZ-101 black adhesive for sealed package of IC, whose curing temperature,curing time, storage period, etc. were investigated in the paper, can be prepared from bisphenol A or bisphenol F epoxy resin, amine curing promoter and flame retarding filler. Comparisons were made with Hysol EO1016 adhesive, a similar product of USA.
出处
《中国胶粘剂》
CAS
1995年第2期21-23,共3页
China Adhesives
