摘要
对实际电镀条件下,氨基磺酸镍镀层具有低应力的现象进行应力理论分析,具有重要的实际意义。本文通过常用电解镍和含硫去极化镍阳极在不同的阳极状态下的镀液和镀层分析,确认了氨基磺酸镍的阳极氧化产物使镀层含硫及应力降低,并由一组氨基磺酸镍和瓦特镍镀层含杂量(不包括硫)、含氢量及织构的对比实验,从应力理论上解释了正常镀低应力氨基磺酸镍时其镀层应力低的原因。至于是何种物质使镀层含硫还有待于进一步的研究。
Plating bath and deposit were investigated under different anodic condition
for which regular electrolytic nickel and sulfur depolarized nickel anodes were
used. The anodic oxidation product of nickel sulfamate was considered to caus
the deposit to contain sulfur and to lower internal stress, Through experiments
contrasting sulfamate with Watts on impurity(not including sulfur), hydrogens
content and texture of the deposit, the reason that the deposit has a low stresse
during normal sulfamate nickel electroplating was explained by using the theory
of stress, But a further study is needed for identification of the anodic oxida-
tion product.
出处
《电镀与精饰》
CAS
1989年第4期3-7,共5页
Plating & Finishing
