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Transient liquid phase diffusion bonding of a single crystal superalloy DD6 被引量:3

Transient liquid phase diffusion bonding of a single crystal superalloy DD6
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摘要 DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added as the melting point depressant. The results show that it is difficult to obtain the joints with the microstructures completely homogeneous. For the joint TLP diffusion bonded at 1290℃ for 12h, about half areas of the beam possessed a γ+γ′ microstructure, nearly identical with that of the base metal, and the other local areas consisted of γ-solution, borides, etc. Prolonging the bonding time to 24h, the inhomogeneous areas in the joint reduced, and the joint property improved. The joint stress-rupture strength at 980℃ and 1100℃ reached 90%-100% and 70%-80% of those of the base metal respectively. DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added as the melting point depressant. The results show that it is difficult to obtain the joints with the microstructures completely homogeneous. For the joint TLP diffusion bonded at 1290℃ for 12h, about half areas of the beam possessed a γ+γ′ microstructure, nearly identical with that of the base metal, and the other local areas consisted of γ-solution, borides, etc. Prolonging the bonding time to 24h, the inhomogeneous areas in the joint reduced, and the joint property improved. The joint stress-rupture strength at 980℃ and 1100℃ reached 90%-100% and 70%-80% of those of the base metal respectively.
出处 《China Welding》 EI CAS 2005年第1期19-23,共5页 中国焊接(英文版)
关键词 single crystal superalloy TLP diffusion bonding joint stress-rupture property single crystal superalloy, TLP diffusion bonding, joint stress-rupture property
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  • 1张新平 等.非晶态钎料研究与应用进展[A]..第八届全国钎焊和扩散年会论文集[C].,1995.33-37.

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